Wet Process Equipment
Overview
Wet Process Equipment supplied by Nice-Tech Co., Ltd. Listed under Semiconductors. Key published specifications: Wafer Size 6-12 inch; Cleaning Technologies Hot DIW(Deionized Water), N2 atomizing two-fluid cleaning; Application Fields Wafer fabrication, advanced packaging; Core Purpose Wafer surface/backside/edge particle/residue removal. Contact the supplier through the RFQ form for pricing, lead time and full datasheets.
Technical specifications
| Wafer Size | 6-12 inch |
|---|---|
| Cleaning Technologies | Hot DIW(Deionized Water), N2 atomizing two-fluid cleaning |
| Application Fields | Wafer fabrication, advanced packaging |
| Core Purpose | Wafer surface/backside/edge particle/residue removal |
