Laser Marking Machine
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Wafer Laser Marking / Dicing System
Overview
Wafer Laser Marking / Dicing System, listed under Laser Marking Machines by Laser Corporation. Laser type UV Laser, wavelength 355 nm and min beam diameter <10µm are among the specifications published.
Technical specifications
| Laser Type | UV Laser |
|---|---|
| Wavelength | 355 nm |
| Min Beam Diameter | <10µm |
| Pulse Frequency | 10 – 200 kHz |
| Output Power | 10 Watts |
| Cooling System | Water-cooled |
| Fθ Marking Field Size | 1.96″ x 1.96″ (50mm x 50mm) |
| X, Y travel Distance | 15.74″ x 11.81″ (400mm x 300 mm) |
| Laser Safety Level | Class I |
| Power Consumed | 5 Kw |
| Warranty Coverage | 1-year |
| Laser Safety Compliance | FDA(CDRH) |
| Running Temperature | 15℃-35℃ / 59°-95°F |
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