Wafer Laser Marking / Dicing System
Overview
Wafer Laser Marking / Dicing System supplied by Laser Corporation. Listed under Laser Marking Machines. Key published specifications: Laser Type UV Laser; Wavelength 355 nm; Min Beam Diameter <10µm; Pulse Frequency 10 – 200 kHz. Contact the supplier through the RFQ form for pricing, lead time and full datasheets.
Technical specifications
| Laser Type | UV Laser |
|---|---|
| Wavelength | 355 nm |
| Min Beam Diameter | <10µm |
| Pulse Frequency | 10 – 200 kHz |
| Output Power | 10 Watts |
| Cooling System | Water-cooled |
| Fθ Marking Field Size | 1.96″ x 1.96″ (50mm x 50mm) |
| X, Y travel Distance | 15.74″ x 11.81″ (400mm x 300 mm) |
| Laser Safety Level | Class I |
| Power Consumed | 5 Kw |
| Warranty Coverage | 1-year |
| Laser Safety Compliance | FDA(CDRH) |
| Running Temperature | 15℃-35℃ / 59°-95°F |
