Wafer De-Taping Tape-F914WT
Model F914WT
Overview
Wafer De-Taping Tape-F914WT supplied by Shenzhen KHJ Technology Co., Ltd. Key published specifications: Backing 2mil; Total Thickness 3.2mil; Adhesion to Steel ≥3.11lbs/in; Tensile Strength ≥17.14lbs/in. Contact the supplier through the RFQ form for pricing, lead time and full datasheets.
Technical specifications
| Backing | 2mil |
|---|---|
| Total Thickness | 3.2mil |
| Adhesion to Steel | ≥3.11lbs/in |
| Tensile Strength | ≥17.14lbs/in |
| Temperature resistance | OK |
| OK | 100℃*10min |
| Certification | RoHS |