ESD End Sealer Label
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Wafer De-Taping Tape-F914WT
Model F914WT
Overview
Wafer De-Taping Tape-F914WT, from Shenzhen KHJ Technology Co., Ltd in Shenzhen, Guangdong. The listing gives backing 2mil, total thickness 3.2mil and adhesion to steel ≥3.11lbs/in.
Technical specifications
| Backing | 2mil |
|---|---|
| Total Thickness | 3.2mil |
| Adhesion to Steel | ≥3.11lbs/in |
| Tensile Strength | ≥17.14lbs/in |
| Temperature resistance | OK |
| OK | 100℃*10min |
| Certification | RoHS |
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