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Laser Depaneling PCB Machine HDZ- UVC3030

Laser Depaneling PCB Machine HDZ- UVC3030

Overview

Laser Depaneling PCB Machine HDZ- UVC3030 supplied by Laser Corporation. Listed under Laser Marking Machines. Key published specifications: Laser Type UV Laser; Wavelength 355 nm; Min Beam Diameter < 10 µm; Pulse Frequency 10 – 200 kHz. Contact the supplier through the RFQ form for pricing, lead time and full datasheets.

Technical specifications

Laser TypeUV Laser
Wavelength355 nm
Min Beam Diameter< 10 µm
Pulse Frequency10 – 200 kHz
Output Power15/20 Watts
Cooling SystemWater-cooled
Fθ Marking Field Size1.96″ x 1.96″ (50mm x 50mm)
X, Y travel Distance15.74″ x 11.81″ (400mm x 300 mm)
Laser Safety LevelClass I
Power Consumed6 Kw
Warranty Coverage1-year
Laser Safety ComplianceFDA (CDRH)
Running Temperature15℃-35℃ / 59°-95°F

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