3166 UV Adhesive for Solder Joint Protection
Model 3166 UV Adhesive
Overview
Shenzhen Super- curing Opto-Electronic CO., Ltd in Shenzhen, Guangdong lists 3166 UV Adhesive for Solder Joint Protection under Protection Systems. Curing condition 600 MJ/cm² (UV), temperature resistance -50°C To 150°C and appearance Clear Or Colored Liquid are among the specifications published.
Technical specifications
| Curing Condition | 600 MJ/cm² (UV) |
|---|---|
| Temperature Resistance | -50°C To 150°C |
| Substrates | PCB, Plastic, Glass, Metal |
| Appearance | Clear Or Colored Liquid |
| Cure Condition | 1200 MJ/cm2 |
| Dielectric Constant | Low |
| Thixotropy | High, Good Visibility |
| Silicone Content | Silicone Free |
| Applicationmethod | Dispensing, Brushing, Or Spraying |
| Weight | 1Kg |
| Viscosity (at 25°C) | 6,000 ± 500 mPa·s |
| Hardness | 78D |
| Glass Transition Temperature (Tg) | 72°C |
| Storage Conditions | 12 months at 8–28°C |
| Viscosity (25°C) | 50000±10000 mPa.s |
| Application | General camera module thread locking |
| Model | 3769D |
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