Ultra-Soft 10W/mK Thermal Pad with Ceramic Filled Silicone for High-End Chip Cooling
Model TIF100 10020-11
Overview
Ultra-Soft 10W/mK Thermal Pad with Ceramic Filled Silicone for High-End Chip Cooling, listed under Silicone Foam by Dongguan Ziitek Electronical Material and Technology Ltd in Guangdong. The listing gives document TIF100 10020-11_Data Sheet.pdf, thermal conductive 10.0W/mK and hardness 20 Shore 00.
Technical specifications
| Document | TIF100 10020-11_Data Sheet.pdf |
|---|---|
| Thermal Conductive | 10.0W/mK |
| Hardness | 20 Shore 00 |
| Thickness | 0.012"~0.200"/(0.30~5.0mm) |
| Density | 3.3g/cm³ |
| Construction | Ceramic Filled Silicone Elastomer |
| Application | High-end Chip |
| Standard Size | 16"x16" (406 mm x 406 mm) |