Ultra-Soft 10W/mK Thermal Pad with Ceramic Filled Silicone for High-End Chip Cooling
Model TIF100 10020-11
Overview
Ultra-Soft 10W/mK Thermal Pad with Ceramic Filled Silicone for High-End Chip Cooling supplied by Dongguan Ziitek Electronical Material and Technology Ltd. Listed under Silicone Foam. Key published specifications: Document TIF100 10020-11_Data Sheet.pdf; Thermal Conductive 10.0W/mK; Hardness 20 Shore 00; Thickness 0.012"~0.200"/(0.30~5.0mm). Contact the supplier through the RFQ form for pricing, lead time and full datasheets.
Technical specifications
| Document | TIF100 10020-11_Data Sheet.pdf |
|---|---|
| Thermal Conductive | 10.0W/mK |
| Hardness | 20 Shore 00 |
| Thickness | 0.012"~0.200"/(0.30~5.0mm) |
| Density | 3.3g/cm³ |
| Construction | Ceramic Filled Silicone Elastomer |
| Application | High-end Chip |
| Standard Size | 16"x16" (406 mm x 406 mm) |