PU Foam Board
Overview
PU Foam Board, listed by TOPOLOGROUP in Shanghai. Published figures include density 28-50kg/m³, thermal conductivity ≤0.024W/(m.k) and bonding strength ≥100kPa.
Technical specifications
| Density | 28-50kg/m³ |
|---|---|
| Thermal conductivity | ≤0.024W/(m.k) |
| Bonding strength | ≥100kPa |
| Rate of dimensional change(70ºCx48h) | 1mm |
| Compressive strength | ≥160kPa |
| Tensile strength | ≥205kPa |
| Water vapor permeability | ≤5Hg/(Pa.m.s) |
