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Polishing Sapphire Wafer 8 Inch Cbn Diamond Grinding Wheel

Polishing Sapphire Wafer 8 Inch Cbn Diamond Grinding Wheel

Overview

Polishing Sapphire Wafer 8 Inch Cbn Diamond Grinding Wheel supplied by SIGNI INDUSTRIAL (SHANGHAI) CO., LTD. Listed under Grinding Wheels. Key published specifications: Certification IDO; Material Diamond + Ceramic bond; Application For pcd/pcbn/cvd tools; Style diamond cup grinding wheel. Contact the supplier through the RFQ form for pricing, lead time and full datasheets.

Technical specifications

CertificationIDO
MaterialDiamond + Ceramic bond
ApplicationFor pcd/pcbn/cvd tools
Stylediamond cup grinding wheel
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TypeAs Per Clients' Drawing
SizeD=50 ~ 400 (mm)
Thickness=0.2 ~ 3.0mm
Widthcustomization
wheel typestraight grinding wheels

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