Laser Cutting and Folding Machine

Overview
Laser Cutting and Folding Machine supplied by Guangdong Xinyu Intelligent Equipment Co., Ltd. Listed under Semiconductors. Key published specifications: project Specification 1; Specification 2 Specification 3; Thickness (mm) ≤35 mm; Lamination efficiency 0.2S/PCS. Contact the supplier through the RFQ form for pricing, lead time and full datasheets.
Technical specifications
| project | Specification 1 |
|---|---|
| Specification 2 | Specification 3 |
| Thickness (mm) | ≤35 mm |
| Lamination efficiency | 0.2S/PCS |
| Lamination Center Alignment | ±0.2 mm |
| weight | 18T |
| Equipment Dimensions (Reference) | 12000*2600*2600 (L × W × H)mm |
| 14000*3500*2600 (L × W × H)mm | 12000*4500*2600 (L × W × H)mm |