HDI PCB
Overview
HDI PCB, from NEXTPCB. Standard stack-ups 1+n+1, 2+n+2, 3+n+3, min. laser via diameter 0.075–0.15mm and min. trace width/spacing 3.5/3.5 mil (2/2 mil with Advanced PCB ) are among the specifications published.
Technical specifications
| Standard Stack-ups | 1+n+1, 2+n+2, 3+n+3 |
|---|---|
| Min. Laser Via Diameter | 0.075–0.15mm |
| Min. Trace Width/Spacing | 3.5/3.5 mil (2/2 mil with Advanced PCB ) |
| HDI Class | HDI III |
| Layer Count | 14 layers |
| Dimensions | 184 × 312mm |
| Board Thickness | 2.0mm |
| Substrate | Shengyi TG170 |
| Smallest Trace Width | 4 mil |
| Smallest Trace Spacing | 4 mil |
| Min. Hole Diameter | 0.1mm (Blind Via) |
| Min. BGA Pad Size | 0.25mm |
| Surface Finish | ENIG |
| Solder Mask Color | Red |
| Application | Consumer Electronics |
| Standard HDI Stack-ups | 1+n+1, 2+n+2, 3+n+3 |
| Max. Laser Via Aspect Ratio | 1:1 (0.75:1 recommended) |
| Max. Filled Via Diameter | 0.45mm |
| Blind Via Dimple | ≤10um |
| Min. Pad Size | 8 mil |
| Layer Buildup | Layer Stack-up Prepregs, cores, foils |
| SMD-Stencils | Laser Stencil |
| Mechanics | V-Scoring Back drilling PCB milling |
| Learn | Blog News |
| NextPCB Capabilities PCB Type | High Tg PCBs |
| Applicable Industries | Automotive PCB Assembly |
| Testing & Inspection | AOI |
| Distributor | UTSOURCE |
| Real-World HDI Application | 14-Layer HDI III PCB |
