Zuo Shi PingIndustrial Supplier Directory

BGA Assembly Services- Ball Grid Array Assembly

BGA Assembly Services- Ball Grid Array Assembly

Overview

BGA Assembly Services- Ball Grid Array Assembly, listed under Assembly by Sota Electronics Co.,LTD in Hangzhou, Zhejiang. Capability Standard, process Key Points and control method Picture are among the specifications published.

Technical specifications

CapabilityStandard
ProcessKey Points
Control MethodPicture
Minimum Solder Ball Pitch0.3 mm/0.5 mm
Minimum Solder Ball Diameter0.15 mm/0.25 mm
Minimum Solder Ball Height0.25mm
Standards-Driven ExcellenceEvery design and
Singapore HeadquarterSOTATRONIX PTE.LTD

Related products