BGA Assembly Services- Ball Grid Array Assembly
Overview
BGA Assembly Services- Ball Grid Array Assembly, listed under Assembly by Sota Electronics Co.,LTD in Hangzhou, Zhejiang. Capability Standard, process Key Points and control method Picture are among the specifications published.
Technical specifications
| Capability | Standard |
|---|---|
| Process | Key Points |
| Control Method | Picture |
| Minimum Solder Ball Pitch | 0.3 mm/0.5 mm |
| Minimum Solder Ball Diameter | 0.15 mm/0.25 mm |
| Minimum Solder Ball Height | 0.25mm |
| Standards-Driven Excellence | Every design and |
| Singapore Headquarter | SOTATRONIX PTE.LTD |
