BGA Assembly Services- Ball Grid Array Assembly
Overview
BGA Assembly Services- Ball Grid Array Assembly supplied by Sota Electronics Co.,LTD. Listed under Assembly. Key published specifications: Capability Standard; Process Key Points; Control Method Picture; Minimum Solder Ball Pitch 0.3 mm/0.5 mm. Contact the supplier through the RFQ form for pricing, lead time and full datasheets.
Technical specifications
| Capability | Standard |
|---|---|
| Process | Key Points |
| Control Method | Picture |
| Minimum Solder Ball Pitch | 0.3 mm/0.5 mm |
| Minimum Solder Ball Diameter | 0.15 mm/0.25 mm |
| Minimum Solder Ball Height | 0.25mm |
| Standards-Driven Excellence | Every design and |
| Singapore Headquarter | SOTATRONIX PTE.LTD |